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M.S.c Patrizia Ring

Fakultät für Ingenieurwissenschaften

Anschrift
Lotharstraße 1
47057 Duisburg
Raum
MA 263
Telefon
+49 203 379 3225
E-Mail
patrizia.ring@uni-due.de
Webseite
https://www.uni-due.de/iw/de/personen/ring.php

Funktionen

  • Mitarbeiter/in, SCIES - Support Center for (International) Engineering Students

  • Mitarbeiter/in, Medieninformatik

Die folgenden Publikationen sind in der Online-Universitätsbibliographie der Universität Duisburg-Essen verzeichnet. Weitere Informationen finden Sie gegebenenfalls auch auf den persönlichen Webseiten der Person.

    Beiträge in Sammelwerken und Tagungsbänden

  • Ring, Patrizia; Hemsing, Annika; Masuch, Maic
    It’s All Fun and Games, Until Someone Gets Hurt : How Game Pace and Player Movement Influence the User Experience in VR
    In: Proceedings of the Extended Abstracts of the CHI Conference on Human Factors in Computing Systems (CHI EA '25) / CHI EA '25: Extended Abstracts of the CHI Conference on Human Factors in Computing Systems; 26 April 2025 - 1 May 2025; Yokohama, Japan / Yamashita, Naomi; Evers, Vanessa; Yatani, Koji; Ding, Xianghua (Sharon) (Hrsg.). New York: Association for Computing Machinery (ACM), 2025, 362
    DOI (Open Access)
  • Ring, Patrizia; Masuch, Maic
    Long-Term Effects of User Expertise and Application Design on Collision Anxiety in VR Games
    In: Proceedings of the 2025 CHI Conference on Human Factors in Computing Systems (CHI '25) / CHI 2025: CHI Conference on Human Factors in Computing Systems; 26 April 2025 - 1 May 2025; Yokohama, Japan / Yamashita, Naomi; Evers, Vanessa; Yatani, Koji; Ding, Xianghua (Sharon); Lee, Bongshin; Chetty, Marshini; Toups-Dugas, Phoebe (Hrsg.). New York: Association for Computing Machinery (ACM), 2025, 1228
    DOI (Open Access)
  • Tietenberg, Julius; Ring, Patrizia; Masuch, Maic
    Virtual Proximity, Real Anxiety : How Co-located VR Gameplay Increases Mutual Player Distance and Fear of Colliding
    In: FDG '25: Proceedings of the 20th International Conference on the Foundations of Digital Games / International Conference on the Foundations of Digital Games (FDG ’25); April 15–18, 2025; Graz, Austria / Pirker, Johanna; Kayali, Fares (Hrsg.). New York: Association for Computing Machinery (ACM), 2025, 12
    DOI (Open Access)
  • Ring, Patrizia; Tietenberg, Julius; Emmerich, Katharina; Masuch, Maic
    Development and Validation of the Collision Anxiety Qestionnaire for VR Applications
    In: Proceedings of the CHI Conference on Human Factors in Computing Systems / CHI '24: CHI Conference on Human Factors in Computing Systems, Honolulu, HI, USA, May 11 - 16, 2024. New York: Association for Computing Machinery, 2024, 605
    DOI
  • Ring, Patrizia; Tietenberg, Julius; Masuch, Maic
    Validation of a German Version of the Collision Anxiety Questionnaire
    In: Proceedings of Mensch und Computer 2024 (MuC 2024) / Mensch und Computer 2024 (MuC 2024): 1 - 4 September 2024; Karlsruhe, Germany / Maedche, Alexander; Beigl, Michael; Gerling, Kathrin; Mayer, Sven (Hrsg.). New York: Association for Computing Machinery (ACM), 2024, S. 370 – 374
    DOI
  • Ring, Patrizia; Masuch, Maic
    Exploring the Influence of Collision Anxiety on Player Experience in XR Games
    In: Entertainment Computing – ICEC 2023: 22nd IFIP TC 14 International Conference, ICEC 2023 ; Bologna, Italy, November 15–17, 2023 ; Proceedings / 22nd IFIP TC 14 International Conference on Entertainment Computing, ICEC 2023, November 15–17, 2023, Bologna, Italy / Ciancarini, Paolo; Di Iorio, Angelo; Hlavacs, Helmut; Poggi, Francesco (Hrsg.). Berlin: Springer Nature Singapore, 2023, S. 203 – 216
    DOI

    • Poster / Posterbeiträge

  • Ring, Patrizia; Masuch, Maic
    Measuring Collision Anxiety in XR Exergames
    In: 2023 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops: VRW 2023 ; 25-29 March 2023, Shanghai, China : Proceedings / 30th IEEE Conference on Virtual Reality and 3D User Interfaces ; Online, 2023, Schanghai, China); Institute of Electrical and Electronics Engineers. Piscataway: Institute of Electrical and Electronics Engineers, 2023, S. 627 – 628
    DOI, Online Volltext