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​THzIz creates an end-to-end Terahertz technology chain from chip to module. For this chain investments in upgrades in the cleanroom of UDE’s Center for Semiconductor Technology and Optoelectronics are made. These include material research equipment for indium phosphide structures with very high electron mobility, key processing equipment for submicrometer device technology and tools for packaging and assembly technology of THz modules with integrated antennas. The project is funded with 7,3M€ (EU/NRW and UDE) in the period of 2019-2022. The THzIZ is based on a cooperation between four departments within UDE’s faculty of engineering (BHE, OE, ATE, and DSV).

Unique environment for THz research at UDE

In addition to the THzIZ, THz research at the UDE is supported by the following projects:

• DFG SFB/TRR196 MARIE researches fundamentals of THz technology for mobile applications
• Two EU-Horizon2020 PhD training networks for THz devices and systems
• BMBF ForLab “SmartBeam” investment program for THz chip technology

Project goals

In the THzIZ the aim is to develop efficient and high performing THz components which are robust and compact modules for industrial use. Further we want to explore new technologies for THz integration including wafer level packaging and additive manufacturing. As a long-term goal we want to create a competence center for integrated THz modules, open for cooperation with industrial companies.

New equipment

To achieve the project goals new equipment is funded by THzIZ. On the one hand side specialized industry-standard software and high performance computing cluster for EM field simulation, electronic and optoelectronic integrated circuit design and physica device modeling are funded. On the other hand side machines for the fabrication and analysis of semiconductor devices and circuits are funded.

A list of some of the new equipment:

• X-Ray diffractometer for high-precision analysis of indium phosphide semiconductor layers
• Confocal microscope for 3D imaging with nanometer resolution
• Micro-mounting system for accurate THz module assembly
• Semi-automatic wirebonder for flexible chip contacting
• Phase noise measurement system with mixers up to 750GHz

Additional investment

• Vacuum metallization system for reduced RC delay through better contacts
• High-precision milling machine for custom THz module housings

Integrated research project

• Funding of 6 PhD students (50%)
• Initial equipment start-up and process recipe development
• Demonstration of integrated THz modules

This project is funded by the European Union and the State of North Rhine-Westphalia EFRE funding identifier: EFRE-0400215