• Scientific and technical consultation on fabrication and analysis of nanostructures for semiconductor and optoelectronic industry
  • Technical consultation on electrical and physical measurement techniques
  • Services in the fields of technology and analytics
  • Advanced training programs for partners in industry, small enterprises and education centers

Scanning Force Microscopy

We analyze materials and devices with respect to topography and surface roughness, determine local potential and current distributions in micro- and optoelectronic devices and measure magnetic fields and conductivities with a spatial resolution down to the 10 nm range. The following techniques are available:

  • Kelvin force microscopy
  • Scanning probe current and scanning probe voltage microscopy
  • Magnetic force microscopy
  • Conductive scanning force microscopy

Technical Equipment


We prepare materials and devices (e.g. metal-semiconductor hybrids, semiconductor heterostructures, nanoparticles, optoelectronic devices) for electron microscopy and perform microscopy at a great variety of materials and samples . The acceleration voltage can be set within a wide range between 50 V and 30 kV. Therefore even sensitive and insulating samples can be analysed.

Time- and Spatially Resolved Optical Spectroscopy

We analyze nanostructures with high spatial (Sub-µm) and temporal (fs/ps-regime) resolution. Besides the analysis of optoelectronics devices we are specialized on the characterization of magnetic semiconductors, ferromagnet-semiconductor hybrids, semiconductor nanostructures and nanoparticles. By time-resolved experiments, characteristic carrier lifetimes of semiconductors, nanostructures and devices can be determined. We can offer the following techniques:

  • Highly spatially resolved magneto-optics
  • Micro-photoluminescence spectroscopy
  • Time-resolved photoluminescence spectroscopy

Technical Equipment

Nanotechnology and Preparation

In our clean room (120 m2, class 100 and 1000), a variety of nanotechnological equipment is available. Lateral nanostructures with sizes down to 20 nm can be achieved. The following techniques are used:

  • Electron beam lithography
  • Optical lithography
  • Metallization using thin film techniques
  • Wet chemical etching and semiconductor processing
  • Contact technology with ultrasonic bonders

Mainly compound semiconductors and metal-semiconductor hybrids are processed

Technical Equipment