Equipment

soldering workstation

Soldering workstation

With everything that is needed. For the assembly of electronic components with through-hole technology (THT) and surface-mount-device (SMD) technology.

Die Filament Drucker der IoT-Garage

Filament Printer

For the production of mechanical components or housings. We use PLA filament as our standard material for printing.

Der Resin Drucker der IoT-Garage

Resin Printer

For the production of mechanical components or housings. Stereolithography (SLA) can be used to produce highly detailed 3D objects.

A bench drill

Bench drill

For drilling holes in various materials.

Picture of a microscope with a clear scale comparison next to it

Webcam-Microscope

For inspecting solder joints and other fine work.

picture of a laser cutter

Laser cutter

For the manufacturing of stencils, mechanical components or housings (in layered assembly) from various materials such as wood or acrylic.

Oszilloskop steht auf einem Tisch

Oscilloscopes

For testing circuits and measuring as well as displaying signals.

You can find detailed technical information such as print dimensions or available filaments in the Moodle course.

Our 3D-Resin-Printing Production Line

Der Resin Drucker der IoT-Garage

3D Resin Printer

Step 1: Choose a design and start the 3D print.

TPM Waschanlage

TPM Washing System

Step 2: After printing, the TPM washing system is used to wash away any resin residue.

Isopropanol Waschanlage

Isopropanol Washing Station

Step 3: The oily film left behind by the TPM washing system is washed off in the isopropanol washing system.

UV Curing Station

UV Curing Station

Step 4: Once the print has been cleaned, it is cured in the UV curing station using UV light and heat.

Fertiger Resin-Druck

Finished Resin-Print

Step 5: Now we have the finished, cleaned, and cured 3D resin print.

Our PCB Production Line

Manufacturing of a 2-layer PCB

Der PCB Maker

PCB Maker

Step 1: In the PCB Maker, the contact holes (vias) are laser-drilled.

Das Galvanische Bad

Electroplating Bath

Step 2: The PCB is then placed in an electroplating bath, where the holes are plated through to establish an electrical connection between the two copper layers.

Der PCB Maker

Step 3: Back in the PCB Maker, the traces on both sides of the PCB are structured using a laser. At the same time, the PCB is already almost completely cut out. After visual a inspection for possible defects, the green solder mask is applied to protect the PCB against corrosion. Finally, the pads are exposed using the laser in the PCB Maker.

Manufacturing of a multi-layer PCB

Der PCB Maker

PCB Maker

Step 1: In the PCB Maker, the contact holes (vias) are laser-drilled.

Die MultiPCB Presse

MultiLayer PCB Press

Step 2: In the Multilayer PCB Press, the inner layers are laminated together, forming a multilayer board from several individual layers.

Der PCB Maker

PCB Maker

Step 3: In the PCB Maker, the outer layers are manufactured and drilled.

Das Galvanische Bad

Electroplating Bath

Step 4: The PCB is then placed in an electroplating bath, where the holes are plated through to establish an electrical connection between the two copper layers.

Der PCB Maker

PCB Maker

Step 5: Back in the PCB Maker, the traces on both sides of the PCB are structured using a laser. At the same time, the PCB is already almost completely cut out. After visual a inspection for possible defects, the green solder mask is applied to protect the PCB against corrosion. Finally, the pads are exposed using the laser in the PCB Maker.

PCB assembly

Der Stencil Printer

Stencil Printer

Step 1: A stencil is used to mask all areas that should not receive solder paste, after which the solder paste is applied.

Bilder der automatischen Pick and Place Maschine. Links geƶffnet, rechts geschlossen.

Automatic Pick-and-Place Machine

Step 2: An automatic pick-and-place machine is used to place components that are required in large quantities and are readily available.

Die manuelle Pick and Place Maschine

Manuel Pick-and-Place Machine

Step 3: A manual pick-and-place machine is used to place components that are available only in small quantities (such as Ball Grid Array components or microcontrollers).

Die Dampfphase

Vapor Phase

Step 4: The PCB is then placed in a vapor phase soldering system to melt the solder and permanently attach the components.

Das Mikroskop

Microscope

Step 5: The assembly can be inspected under a microscope (optionally after each step).